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STTS424E02BDA3F bảng dữ liệu(PDF) 39 Page - STMicroelectronics

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STTS424E02BDA3F bảng dữ liệu(HTML) 39 Page - STMicroelectronics

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STTS424E02
Maximum ratings
39/51
8
Maximum ratings
Stressing the device above the ratings listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 25.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
TSTG
Storage temperature
–60 to 150
°C
TSLD
(1)
1.
Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C
for between 90 to 150 seconds).
Lead solder temperature for 10 seconds
260
°C
VIO
Input or output voltage - all pins
VSS – 0.3 to VDD +0.5
V
VDD
Supply voltage
VSS – 0.3 to 6.5
V
IO
Output current
10
mA
PD
Power dissipation
320
mW
θJA
Thermal resistance
DA package
128
°C/W
DN package
130
°C/W



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