DEVICE INFORMATION

DEVICE I/O SCHEMATIC

13 W

8 W

EN

1MW

Enable

500 W

Output

OUT

IN

1MW

Input

500 W

ISO721M-EP

PACKAGE CHARACTERISTICS

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Shortest terminal to terminal distance through air

4.8

mm

Shortest terminal to terminal distance across the

L(102) Minimum external tracking (Creepage)

4.3

mm

package surface

Tracking resistance (comparative tracking

DIN IEC 60112/VDE 0303 Part 1

≥ 175

V

index)

Minimum internal gap (internal clearance)

Distance through insulation

0.008

mm

of the barrier tied together creating a two-terminal

Ω

Isolation resistance

Ω

100°C

Barrier capacitance

1

pF

Input-to-output

Input capacitance to ground

1

pF

(1)

Creepage and clearance requirements are applied according to the specific equipment isolation standards of an application. Care should

be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the

printed circuit board do not reduce this distance.

Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation

Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications.

IEC 60664-1 RATINGS TABLE

PARAMETER

TEST CONDITIONS

SPECIFICATION

Basic isolation group

Material group

IIIa

Rated mains voltage

≤150 VRMS

I-IV

Installation classification

Rated mains voltage

≤300 VRMS

I-III

Equivalent Input and Output Schematic Diagrams

12

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