AS3722 datasheet(16/199 Pages) AMSOSRAM

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ams Datasheet

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[v1-01] 2015-Sep-07

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AS3722 − Absolute Maximum Ratings

Note(s) and/or Footnote(s):

1. Depending on actual PCB layout and PCB used

2. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Nonhermetic Solid State Surface Mount Devices”

Continuous Power Dissipation (TA = 70°C)

Continuous power

dissipation

1.4

(1) for CTBGA124 package

(RTHJA ~ 38K/W)

Continuous power

dissipation

1.3

(1) for WL-CSP108 package

(RTHJA ~ 40K/W)

Electrostatic Discharge

ESDHBM

Electrostatic Discharge

HBM

±1.5

Norm:

JEDEC JESD22-A114F

Temperature Ranges and Storage Conditions

Operating Temperature

-40

°C

Junction Temperature

125

°C

TSTRG

Storage Temperature

Range

-55

125

°C

TBODY

Package Body

Temperature

260

°C

Norm IPC/JEDEC

J-STD-020(2)

RHNC

Relative Humidity

non-condensing

585

MSL

Moisture Sensitivity Level

for CTBGA, represents a

max. floor life time of 168h

for WL-CSP, represents an

unlimited max. floor life

time

Bump Temperature (CTBGA Soldering)

TPEAK

Soldering Profile

235

245

°C

Peak Temperature

tWELL

Well Time above 217°C

Symbol

Parameter

Min

Max

Units

Comments

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