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STM32F103XC bảng dữ liệu(PDF) 38 Page - STMicroelectronics

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STM32F103XC bảng dữ liệu(HTML) 38 Page - STMicroelectronics

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Electrical characteristics
STM32F103xC, STM32F103xD, STM32F103xE
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5.3
Operating conditions
5.3.1
General operating conditions
5.3.2
Operating conditions at power-up / power-down
The parameters given in Table 10 are derived from tests performed under the ambient
temperature condition summarized in Table 9.
Table 8.
Thermal characteristics
Symbol
Ratings
Value
Unit
TSTG
Storage temperature range
–65 to +150
°C
TJ
Maximum junction temperature
150
°C
Table 9.
General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
Internal AHB clock frequency
0
72
MHz
fPCLK1
Internal APB1 clock frequency
0
36
fPCLK2
Internal APB2 clock frequency
0
72
VDD
Standard operating voltage
2
3.6
V
VBAT
Backup operating voltage
1.8
3.6
V
P
D
Power dissipation at TA =
85 °C for suffix 6 or TA =
105 °C for suffix 7(1)
1.
If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.2: Thermal
characteristics on page 113).
LQFP144
TBD(2)
2.
TBD = to be determined.
mW
LQFP100
434
LQFP64
444
LFBGA100
487
LFBGA144
TBD(2)
TA
Ambient temperature for 6
suffix version
Maximum power dissipation
–40
85
°C
Low power dissipation(3)
3.
In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see
Table 6.2: Thermal characteristics on page 113).
–40
105
Ambient temperature for 7
suffix version
Maximum power dissipation
–40
105
°C
Low power dissipation(3)
–40
125
TJ
Junction temperature range
6 suffix version
–40
105
°C
7 suffix version
–40
125



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