DIO1413/1414

Version 1.2, Sep 2024

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© 2024 DIOO MICROCIRCUITS CO., LTD.

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10.Application Information

Important notice: Validation and testing are the most reliable ways to confirm system functionality. The

application information is not part of the specification and is for reference purpose only.

A host device can perform thermal management using DIO1413/1414. The DIO1413/1414 can directly measure

the temperature of the internal BJT and up to three external temperatures. Thus up to four temperatures at

different locations can be monitored with one chip. The

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ALERT and

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THERM /ADDR pins can be asserted to

achieve two levels of over-temperature alarm. Typical application diagrams for the two chips are shown in Figure

8 and Figure 9.

The supported configurations for the external BJTs are as shown in the following figures. The DIO1413 supports

PNP and diode-connected NPN for DP1/DN1 and DP2/DN2, as shown in Figure 10 and Figure 11. The DIO1414

supports PNP and diode-connected NPN for DP1 and DN1, as shown in Figure 10 and Figure 11. However,

DP2/DN3 and DN2/DP3 of DIO1414 support only the diode-connected NPN, as shown in Figure 11, or the

anti-parallel diode-connected NPN, as shown in Figure 12.

Figure 8. System design for DIO1413

Figure 9. System design for DIO1414