ANT-2.4-CW-RCL-RPS datasheet(19/73 Pages) MICROCHIP

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WINCS02IC and WINCS02 Family

Device Overview

Data Sheet

DS70005577B - 19

Figure 2-11. Example of WINCS02 Module Placement on Host Board (Top Layer)

Host Board Outline

Module Outline

Copper Keepout

Module Footprint

Exposed GND Pad

Underneath Module

GND Plane on Host Board

RTCC Oscillator Placement

2.6

WINCS02 Module RF Considerations

The overall performance of the system is significantly affected by the product design, environment

and application. The product designer must ensure system-level shielding (if required) and verify the

performance of the product features and applications.

Consider the following guidelines for optimal RF performance:

• The WINCS02 Module must be positioned in a noise-free RF environment and must be kept far

away from high-frequency clock signals and any other sources of RF energy.

• The antenna must not be shielded by any metal objects.

• The power supply must be clean and noise-free.

• Make sure that the width of the traces routed to GND, VDD rails are sufficiently large for handling

peak TX current consumption.

Note: The WINCS02 Module includes RF shielding on top of the board as a standard feature.

2.7

WINCS02 Module Antenna Considerations

2.7.1

PCB Antenna

For the WINCS02PE/PC Module, the PCB antenna is fabricated on the top copper layer. The layers

below the antenna do not have copper trace. It is recommended that the module to be mounted on

the edge of the host board and to have no PCB material below the antenna structure of the module

and no copper traces or planes on the host board in that area.

The following table lists the technical specification of the PCB antenna when tested with the

WINCS02 Module mounted on the WINCS02 Add-On Board.

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