TPS799 datasheet(16/49 Pages) TI2

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35°C above the maximum expected ambient condition of a particular application. This configuration produces a

worst-case junction temperature of 125°C at the highest expected ambient temperature and worst-case load.

The internal protection circuitry of the TPS799 is designed to protect against overload conditions. This circuitry

is not intended to replace proper heat sinking. Continuously running the device into thermal shutdown degrades

device reliability.

10.1.2.2 Power Dissipation

The ability to remove heat from the die is different for each package type, presenting different considerations

in the PCB layout. The PCB area around the device that is free of other components moves the head from

the device to the ambient air. Performance data for JEDEC low- and high-K boards are given in the Thermal

Information table near the front of this data sheet. Using heavier copper increases the effectiveness in removing

heat from the device. The addition of plated through-holes to heat-dissipating layers also improves heat-sink

effectiveness.

Power dissipation depends on input voltage and load conditions. Power dissipation is equal to the product of the

output current times the voltage drop across the output pass element, as shown in Equation 2:

+ VIN*VOUT @ IOUT

(2)

10.1.2.3 Package Mounting

Solder pad footprint recommendations for the TPS799 are available from the TI's website at www.ti.com.

10.2 Layout Example

CIN

COUT

CNR

GND

TPS799

Represents via used for

application specific connections.

Figure 10-1. Layout Example

TPS799

SBVS056L – JANUARY 2005 – REVISED FEBRUARY 2022

www.ti.com

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