TMP411CD datasheet(6/61 Pages) TI2

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6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Input voltage

Pins 2, 3, 4 only

TMP411 (Legacy chip)

–0.5

(V+) + 0.5

Pins 6, 7, 8 only

–0.5

Pins 2, 3 only

TMP411 (New chip)

TMP411D

–0.5

Pins 4, 6, 7, 8 only

–0.5

Input current

Power supply, V+

TMP411 (Legacy chip)

TMP411 (New chip)

TMP411D

Operating temperature range

–55

127

°C

Junction temperature, TJ(max)

150

°C

Storage temperature, Tstg

–60

130

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±3000

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

Over free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

V+

Supply voltage, TMP411

2.7

3.3

5.5

Supply voltage, TMP411D

1.62

3.3

5.5

Operating free-air temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TMP411/TMP411D

UNIT

D (SOIC)

Legacy chip

D (SOIC)

New chip

DGK

(VSSOP)

Legacy chip

DGK

(VSSOP)

New chip

DDF

(SOT-23)

8 PINS

RθJA

Junction-to-ambient thermal resistance

112.3

109.9

166.1

161.5

182.4

°C/W

Rθ

JC(top)

Junction-to-case (top) thermal resistance

59.4

49.8

58.3

71.1

98.9

°C/W

RθJB

Junction-to-board thermal resistance

53.0

56.9

86.7

96.6

99.1

°C/W

ψJT

Junction-to-top characterization parameter

13.6

6.0

7.5

9.2

10.4

°C/W

TMP411, TMP411D

SBOS383E – DECEMBER 2006 – REVISED JULY 2025

www.ti.com

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