TMP411CD datasheet(46/61 Pages) TI2

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10 Device and Documentation Support

10.1 Documentation Support

10.1.1 Related Documentation

• Texas Instruments, Optimizing Remote Temperature Sensor Design, application note

• Texas Instruments, TMP451 ±1°C Remote and Local Temperature Sensor With η-Factor and Offset

Correction, Series-Resistance Cancellation, and Programmable Digital Filter, data sheet

• Texas Instruments, TMP4718 High-Accuracy Remote and Local Temperature Sensor with Pin Programmable

Alert Thresholds, data sheet

• Texas Instruments, ±1°C Remote and Local Temperature Sensor, data sheet

• Texas Instruments, Remote Temperature Sensor Transistor Selection Guide, application note

• Texas Instruments, TMP411 Evaluation Module, EVM

10.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

10.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

10.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

10.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

10.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

11 Revision History

Changes from Revision D (August 2016) to Revision E (July 2025)

Page

• Added TMP411D device throughout the document............................................................................................1

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Changed the terminology "Master" to "Controller" and "Slave" to "Target" throughout the document .............. 1

• Updated the "Conversion time" throughout the document................................................................................. 1

• Changed the average and shutdown currents throughout the document...........................................................1

• Updated the maximum voltage ratings on D+/D- pins........................................................................................6

• Updated the maximum voltage rating on pins 4, 6, 7, 8..................................................................................... 6

• Updated the maximum voltage rating on V+ pin................................................................................................ 6

• Added D and DGK packages “Thermal Information” for the New chip...............................................................6

• Added "Conversion time" for the New chip in Electrical Characteristics table....................................................7

• Updated the typo for Hysteresis typical value from 500mV to 170mV................................................................7

• Added "Logic input current" for the New chip in Electrical Characteristics table................................................ 7

TMP411, TMP411D

SBOS383E – DECEMBER 2006 – REVISED JULY 2025

www.ti.com

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