AD4084BBCZ datasheet(8/94 Pages) AD

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Data Sheet

AD4084

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 8 of 94

Table 3. Absolute Maximum Ratings

Parameter

Rating

Analog Inputs

IN+, AUXIN+, IN−, and AUXIN− to GND

−0.3V to +3.6V

Analog Output

CMO

−0.3V to +3.6V

Supply Voltage

REFIN and VDD33 to GND

−0.3V to +3.6V

VDDLDO to GND

−0.3V to +2.75V

VDD11 to GND

−0.3V to +1.26V

IOVDD to GND

−0.3V to +1.26V

Digital Inputs and Outputs

Inputs (CNV± and CLK±) to GND

−0.3V to +2.75V

LVDS OUTPUT (DCO±, DA±, and DB±) to GND

−0.3V to +1.26V

CS, SCLK, and SDI to GND

−0.3V to +2.75V

GPIO0, GPIO1, GPIO2, and GPIO3 to GND

−0.3V to +1.26V

Temperature

Storage Range

−55°C to +150°C

Operating Range

−40°C to +85°C

Maximum Reflow (Package) as per

JEDEC J-STD-020

260°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and operating

environment. Careful attention to PCB thermal design is required.

Table 4. Thermal Resistance

Package

Type

θJA1

ΨJT1

ΨJB1

θJB2

θJC3

Unit

BC-49-8

66.8

1.7

45.1

45.9

53.1

°C/W

1 θJA, ΨJT, and ΨJB are modeled using a JEDEC 2S2P test PCB with 16 thermal

vias, in a JEDEC natural convection environment.

2 θJB is modeled using a JEDEC 2S2P test PCB with 16 thermal vias, in a

JEDEC junction to board environment.

3 θJC is modeled using a JEDEC 1S test PCB, with an infinite heatsink attached

directly to the package surface.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD-protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Field induced charged-device model (FICDM) per ANSI/ESDA/JE-

DEC JS-002.

ESD Ratings for the AD4084

Table 5. AD4084, 49-Ball CSP_BGA

ESD Model

Withstand Threshold (V) Class

HBM (Pin E1, Pin E2, Pin D1, and Pin

D2 (IN−, AUXIN−, IN+, and AUXIN+,

respectively))

1000

HBM (All other pins)

1500

FICDM

750

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged

devices and circuit boards can discharge without detection.

Although this product features patented or proprietary protec-

tion circuitry, damage may occur on devices subjected to high

energy ESD. Therefore, proper ESD precautions should be

taken to avoid performance degradation or loss of functionality.

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