MSP430 datasheet(35/96 Pages) TI2

35 / 96 page

MSP430G2533, MSP430G2433, MSP430G2333, MSP430G2233

MSP430G2403, MSP430G2303, MSP430G2203

www.ti.com

SLAS734G – APRIL 2011 – REVISED APRIL 2016

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Product Folder Links: MSP430G2533 MSP430G2433 MSP430G2333 MSP430G2233 MSP430G2403 MSP430G2303

MSP430G2203

Specifications

(1)

This parameter defines the minimum supply voltage VCC when the data in RAM remains unchanged. No program execution should

happen during this supply voltage condition.

5.36 RAM

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

MAX

UNIT

V(RAMh)

RAM retention supply voltage (1)

CPU halted

1.6

(1)

Tools that access the Spy-Bi-Wire interface must wait for the maximum tSBW,En time after pulling the TEST/SBWCLK pin high before

applying the first SBWCLK clock edge.

(2)

fTCK may be restricted to meet the timing requirements of the module selected.

5.37 JTAG and Spy-Bi-Wire Interface

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

VCC

MIN

TYP

MAX

UNIT

fSBW

Spy-Bi-Wire input frequency

2.2 V

MHz

tSBW,Low

Spy-Bi-Wire low clock pulse duration

2.2 V

0.025

µs

tSBW,En

Spy-Bi-Wire enable time

(TEST high to acceptance of first clock edge(1))

2.2 V

µs

tSBW,Ret

Spy-Bi-Wire return to normal operation time

2.2 V

100

µs

fTCK

TCK input frequency(2)

2.2 V

MHz

RInternal

Internal pulldown resistance on TEST

2.2 V

Ω

(1)

After the fuse is blown, no further access to the JTAG/Test, Spy-Bi-Wire, and emulation features is possible, and JTAG is switched to

bypass mode.

5.38 JTAG Fuse

(1)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

MAX

UNIT

VCC(FB)

Supply voltage during fuse-blow condition

TA = 25°C

2.5

VFB

Voltage level on TEST for fuse blow

IFB

Supply current into TEST during fuse blow

100

tFB

Time to blow fuse

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