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ADS5294IPFPR bảng dữ liệu(PDF) 69 Page - Texas Instruments |
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ADS5294IPFPR bảng dữ liệu(HTML) 69 Page - Texas Instruments |
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69 / 82 page ![]() 69 ADS5294 www.ti.com SLAS776E – NOVEMBER 2011 – REVISED APRIL 2018 Product Folder Links: ADS5294 Submit Documentation Feedback Copyright © 2011–2018, Texas Instruments Incorporated 11 Power Supply Recommendations The device requires three supplies in order to operate properly. These supplies are AVDD and LVDD. All supplies must be driven with low-noise sources to be able to achieve the best performance from the device. When determining the drive current needed to drive each of the supplies of the device, a margin of 50-100% over the typical current might be needed to account for the current consumption across different modes of operation. Please also refer to Reset Timing after power up. 12 Layout 12.1 Layout Guidelines A single ground plane is sufficient to give good performance, provided the analog, digital, and clock sections of the board are cleanly partitioned. See the ADS5294VM Evaluation Module (SLAU355) for placement of components, routing, and grounding. Because the ADS5294 already includes internal decoupling, minimal external decoupling can be used without loss in performance. For example, the ADS5294EVM uses a single 0.1-µF decoupling capacitor for each supply, placed close to the device supply pins. The exposed pad at the bottom of the package is the main path for heat dissipation. Solder the pad to a ground plane on the PCB for best thermal performance. The pad must be connected to the ground plane through the optimum number of vias. See TI’s thermal Web site at www.ti.com/thermal for additional information. |
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