LP8728B-Q1

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SNVSA70 – FEBRUARY 2015

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN

Voltage on power pins (AVDD, VIN_Bx)

–0.3

6

V

VFB

Voltage on feedback pins (FB_Bx)

–0.3

6

V

VSW

Voltage on buck converter switch pins (SW_Bx)

(GND_Bx – 0.2 V) to (VIN_Bx + 0.2 V) with 6 V max

V

VDIG

Voltage on digital pins (PG_Bx, EN_Bx, DEFSEL)

(AGND – 0.2V) to (AVDD + 0.2 V) with 6 V max

V

VBYP

Voltage on BYP pin

–0.3

2

V

TJ(MAX)

Maximum operating junction temperature(2)

150

°C

Maximum lead temperature (Soldering)

See(3)

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and

disengages at TJ = 130°C (typical).

(3)

For detailed soldering specifications and information, please refer to Texas Instruments Application Note Leadless Leadframe Package

(LLP) SNOA401.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per AEC Q100-002(1)

±2000

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per AEC Q100-011

±750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

VIN

Input voltage on AVDD, VIN_B1, VIN_B2, VIN_B3 and VIN_B4 pins

4.5

5

5.5

V

TA

Operating ambient temperature(2)

–40

125

°C

Effective output capacitance during operation.

COUT

5

10

12

µF

Min value over TA –40°C to 125°C.

Effective input capacitance during operation. 4.5 V

≤ VIN_Bx ≤ 5.5 V.

CIN

2.5

10

µF

Min value over TA –40°C to 125°C.

Effective inductance during operation

L

0.47

1.5

2

µF

Min value over TA –40°C to 125°C.

(1)

All voltage values are with respect to network ground terminal.

(2)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the

maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package

in the application (RθJA), as given by the following equation: TA(max) = TJ(max) – (RθJA × PD(max))

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