5.3 Recommended Operating Conditions (continued)

over operating free-air temperature range (unless otherwise noted)(1) (2) (3)

VCCI

VCCO

MIN

MAX

UNIT

VIL

Low-level

input voltage

DIR

(referenced to VCCA)(5)

1.65V to 1.95V

VCCA × 0.35

V

2.3V to 2.7V

0.7

3V to 3.6V

0.8

4.5V to 5.5V

VCCA × 0.3

VI

Input voltage

0

5.5

V

VO

Output voltage

0

VCCO

V

IOH

High-level output current

1.65V to 1.95V

–4

mA

2.3V to 2.7V

–8

3V to 3.6V

–24

4.5V to 5.5V

–32

IOL

Low-level output current

1.65V to 1.95V

4

mA

2.3V to 2.7V

8

3V to 3.6V

24

4.5V to 5.5V

32

Δt/Δv

Input transition

rise or fall rate

Data inputs

1.65V to 1.95V

20

ns/V

2.3V to 2.7V

20

3V to 3.6V

10

4.5V to 5.5V

5

Control input

1.65V to 5.5V

5

TA

Operating free-air temperature

–40

125

°C

(1)

VCCI is the VCC associated with the input port.

(2)

VCCO is the VCC associated with the output port.

(3)

All unused data inputs of the device must be held at VCCI or GND for proper device operation. See Implications of Slow or Floating

CMOS Inputs, SCBA004.

(4)

For VCCI values not specified in the data sheet, VIH min = VCCI × 0.7V, VIL max = VCCI × 0.3V.

(5)

For VCCI values not specified in the data sheet, VIH min = VCCA × 0.7V, VIL max = VCCA × 0.3V.

5.4 Thermal Information

THERMAL METRIC(1)

SN74LVC2T45-Q1

UNIT

DCU

8 PINS

RθJA

Junction-to-ambient thermal resistance

246.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

95.4

°C/W

RθJB

Junction-to-board thermal resistance

157.8

°C/W

ψJT

Junction-to-top characterization parameter

37

°C/W

ψJB

Junction-to-board characterization parameter

156.9

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

SN74LVC2T45-Q1

SCES818C – SEPTEMBER 2010 – REVISED JULY 2024

Copyright © 2024 Texas Instruments Incorporated

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