SY75608 datasheet(37/44 Pages) MICROCHIP

tên linh kiện	SY75608

Giải thích chi tiết về linh kiện	8 or 12 Output Ultra-Low Additive Jitter

PDF	44 Pages

Scroll/Zoom	100%

nhà sản xuất	MICROCHIP [Microchip Technology]

Trang chủ	http://www.microchip.com

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37 / 44 page

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2021 - 2023 Microchip Technology Inc. and its subsidiaries

DS20006363D-page 37

SY75608/612

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

4.25

MILLIMETERS

0.50 BSC

MIN

MAX

7.90

Contact Pad Length (X56)

Contact Pad Width (X56)

0.85

0.30

NOM

Contact Pad to Contact Pad (X52)

0.20

Thermal Via Diameter

Thermal Via Pitch

0.33

1.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Contact Pad to Center Pad (X56)

0.85

Microchip Technology Drawing C04-27665 Rev A

SILK SCREEN

ØV

56-Lead Very Thin Plastic Quad Flat, No Lead Package (K3C) - 8x8x1.0 mm Body [VQFN]

With 4.15 mm Exposed Pad

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