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MPC8358E bảng dữ liệu(PDF) 68 Page - Freescale Semiconductor, Inc

tên linh kiện MPC8358E
Giải thích chi tiết về linh kiện  PowerQUICC??II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
PDF  112 Pages
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nhà sản xuất  FREESCALE [Freescale Semiconductor, Inc]
Trang chủ  http://www.freescale.com
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MPC8358E bảng dữ liệu(HTML) 68 Page - Freescale Semiconductor, Inc

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MPC8360E/MPC8358E PowerQUICC™ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 2
68
Freescale Semiconductor
Package and Pin Listings
Figure 51 provide the AC test load for the USB.
Figure 51. USB AC Test Load
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8360E/58E is
available in a tape ball grid array (TBGA), see Section 21.1, “Package Parameters for the TBGA Package
and Section 21.2, “Mechanical Dimensions of the TBGA Package,” for information on the package.
21.1
Package Parameters for the TBGA Package
The package parameters for rev 2.0 silicon are as provided in the following list. The package type is 37.5
mm
× 37.5 mm, 740 tape ball grid array (TBGA).
Package outline
37.5 mm
× 37.5 mm
Interconnects
740
Pitch
1.00 mm
Module height (typical)
1.46 mm
Solder Balls
62 Sn/36 Pb/2 Ag (ZU package)
95.5 Sn/0.5 Cu/4Ag (VV package)
Ball diameter (typical)
0.64 mm
Output
Z0 = 50 Ω
OVDD/2
RL = 50 Ω



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