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MPC8358E bảng dữ liệu(PDF) 85 Page - Freescale Semiconductor, Inc

tên linh kiện MPC8358E
Giải thích chi tiết về linh kiện  PowerQUICC??II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications
PDF  96 Pages
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nhà sản xuất  FREESCALE [Freescale Semiconductor, Inc]
Trang chủ  http://www.freescale.com
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MPC8358E bảng dữ liệu(HTML) 85 Page - Freescale Semiconductor, Inc

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MPC8358E PowerQUICC™ II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 1
Freescale Semiconductor
85
Thermal
4. Insert the chosen SPMF, COREPLL, CEPMF and CEPDF to the RCWL fields respectively.
Example:
•
To configure the device with CSB clock rate of 266 MHz, core rate of 400 MHz, and QUICC
Engine clock rate 300 MHz while the input clock rate is 33 MHz. Conf No. “s10” and “c1” are
selected from Table 74. SPMF is “1000,” CORPLL is “0000011,” CEPMF is “01001,” and CEPDF
is “0.”
23 Thermal
This section describes the thermal specifications of the MPC8358E.
23.1
Thermal Characteristics
Table 75 provides the package thermal characteristics for the 668 29 mm x 29 mm PBGA package.
SPMF
CORE
PLL
CEPMF CEPDF
Input Clock
(MHz)
CSB Freq
(MHz)
Core Freq
(MHz)
QUICC
Engine
Freq (MHz)
400
(MHz)
1000
0000011
01001
0
33
266
400
300
∞
Table 75. Package Thermal Characteristics for the PBGA Package
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient Natural Convection on single layer board (1s)
RθJA
20
°C/W
1, 2
Junction-to-ambient Natural Convection on four layer board (2s2p)
RθJA
14
°C/W
1, 2, 3
Junction-to-ambient (@1 m/s) on single layer board (1s)
RθJMA
15
°C/W
1, 3
Junction-to-ambient (@ 1 m/s) on four layer board (2s2p)
RθJMA
11
°C/W
1, 3
Junction-to-board thermal
RθJB
6°C/W
4
Junction-to-case thermal
RθJC
4°C/W
5



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