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LPC2364 bảng dữ liệu(PDF) 40 Page - NXP Semiconductors |
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LPC2364 bảng dữ liệu(HTML) 40 Page - NXP Semiconductors |
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40 / 47 page ![]() LPC2364_66_68_2 © NXP B.V. 2007. All rights reserved. Preliminary data sheet Rev. 02 — 1 October 2007 40 of 47 NXP Semiconductors LPC2364/66/68 Fast communication chip 10. Dynamic characteristics [1] Characterized but not implemented as production test. Guaranteed by design. [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages. [3] Bus capacitance Cb in pF, from 10 pF to 400 pF. Table 7. Dynamic characteristics of USB pins (full-speed) CL = 50 pF; Rpu = 1.5 kΩ on D+ to VDD(3V3), unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit tr rise time 10 % to 90 % 8.5 - 13.8 ns tf fall time 10 % to 90 % 7.7 - 13.7 ns tFRFM differential rise and fall time matching tr /tf - - 109 % VCRS output signal crossover voltage 1.3 - 2.0 V tFEOPT source SE0 interval of EOP see Figure 7 160 - 175 ns tFDEOP source jitter for differential transition to SE0 transition see Figure 7 −2 - +5 ns tJR1 receiver jitter to next transition −18.5 - +18.5 ns tJR2 receiver jitter for paired transitions 10 % to 90 % −9 - +9 ns tEOPR1 EOP width at receiver must reject as EOP; see Figure 7 [1] 40 --ns tEOPR2 EOP width at receiver must accept as EOP; see Figure 7 [1] 82 --ns Table 8. Dynamic characteristics Tamb = −40 °C to +85 °C for commercial applications; VDD(3V3) over specified ranges.[1] Symbol Parameter Conditions Min Typ[2] Max Unit External clock fosc oscillator frequency 10 - 25 MHz Tcy(clk) clock cycle time 40 - 100 ns tCHCX clock HIGH time Tcy(clk) × 0.4 - - ns tCLCX clock LOW time Tcy(clk) × 0.4 - - ns tCLCH clock rise time - - 5 ns tCHCL clock fall time - - 5 ns I2C-bus pins (P0[27] and P0[28]) tf(o) output fall time VIH to VIL 20 + 0.1 × Cb[3] --ns |
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