TLC976CDGG datasheet(1/17 Pages) TI

tên linh kiện	TLC976CDGG

Giải thích chi tiết về linh kiện	10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR

PDF	17 Pages

Scroll/Zoom	100%

nhà sản xuất	TI [Texas Instruments]

Trang chủ	http://www.ti.com

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TLC976C

10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR

SLAS193 – OCTOBER 1998

1

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

D Correlated Double Sampling (CDS), AGC

and High Speed 10-Bit ADC in a Single

Package

D 5-V Analog Power Supply and 3.3-V Digital

Power Supply

D Power Down Mode

D 56-Pin TSSOP (DGG) Package with

Multichip Module Assembly for Isolation

CDS/AGC

D AGC Gain Range of 5 dB to 39 dB

D Black Level Clamp Circuit

D Direct Connection to ADC Input

D Voltage Reference for ADC

Analog-to-Digital Converter

D 10-Bit Resolution

D Maximum Conversion Rate...20 MSPS

(MIN)

D Differential Nonlinearity... 0.75 LSB (TYP)

D Analog Input Voltage Range of 2 Vp-p

D 3.3 V CMOS Digital Interface

Applications

D PC Camera

D Digital Camera

D Camcorder

D CCD Scanner

description

The TLC976 is a multichip module (MCM) subsystem designed for interfacing Charge-Coupled Device (CCD)

in camcorder and digital camera systems. The TLC976 includes correlated double sampler (CDS), automatic

gain control (AGC), black level clamp circuit, 10 bit, 20 MSPS analog-to-digital converter (ADC), and internal

reference voltage generator for ADC.

The CDS/AGC can be connected directly to the ADC input or a separate signal can be connected directly to

the ADC input. A power-down mode is provided.

Assembled using the MCM process, the TLC976 provides isolation between the noisy digital domain and the

noise sensitive analog signals. The CDS/PGA, black level clamps are on one die and the ADC is on a separate

die. The separate dies significantly reduce the substrate noise to the analog section.

The TLC976 comes in a 56-pin TSSOP package with 0,50 mm pin pitch. This is about 25% smaller than using

two separate 32-pin quad flat packs (QFP).

Copyright

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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SHV

GND1

BLK-PULSE

OFFSET

VCC3

DRIVE-OUT

GND3

CDS-STBY

VRB-OUT

VRT-OUT

A-SUB

D-SUB

DVSS

D0

D1

D2

D3

D4

DVSS

DVDD

D5

D6

D7

D8

D9

RESET

DVSS

AVDD

SHR

VCC1

CLP2

DATA-IN

AGCGAIN

OBCLP

AGCCLP

SH-PULSE

GND2

VCC2

A-SUB

DVDD

AVSS

VIN

D-SUB

AVSS

VRB-IN

VRT-IN

AVSS

AVDD

AD-STBY

OE

CLK

DGG PACKAGE

(TOP VIEW)

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