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LIS331DL bảng dữ liệu(PDF) 9 Page - STMicroelectronics |
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LIS331DL bảng dữ liệu(HTML) 9 Page - STMicroelectronics |
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9 / 38 page ![]() LIS331DL Mechanical and electrical specifications 9/38 2 Mechanical and electrical specifications 2.1 Mechanical characteristics Table 2. Mechanical characteristics (1) (2) Symbol Parameter Test conditions Min. Typ.(3) Max. Unit FS Measurement range(4) FS bit set to 0 ±2.0 ±2.3 g FS bit set to 1 ±8.0 ±9.2 So Sensitivity FS bit set to 0 18 mg/digit FS bit set to 1 72 TCSO Sensitivity change vs temperature FS bit set to 0 ±0.01 %/°C TyOff Typical zero-g level offset accuracy(5),(6) FS bit set to 0 ±40 mg FS bit set to 1 ±60 mg TCOff Zero-g level change vs temperature Max delta from 25°C ±0.5 mg/°C Vst Self test output change(7),(8),(9) FS bit set to 0 STP bit used X axis -11 LSb FS bit set to 0 STP bit used Y axis 11 LSb FS bit set to 0 STP bit used Z axis -11 LSb BW System bandwidth(10) ODR/2 Hz Top Operating temperature range -40 +85 °C Wh Product weight 20 mgram 1. All the parameters are specified @ Vdd= 2.5 V, T = 25°C unless otherwise noted 2. The product is factory calibrated at 2.5V. The operational power supply range is from 3.0V to 3.6V. 3. Typical specifications are not guaranteed 4. Verified by wafer level test and measurement of initial offset and sensitivity 5. Typical zero-g level offset value after MSL3 preconditioning 6. Offset can be eliminated by enabling the built-in high pass filter 7. If STM bit is used values change in sign for all axes 8. Self Test output changes with the power supply. Self test “output change” is defined as OUTPUT[LSb](Self-test bit on ctrl_reg1=1) -OUTPUT[LSb](Self-test bit on ctrl_reg1=0). 1LSb=4.6g/256 at 8bit representation, ±2.3g Full-Scale 9. Output data reach 99% of final value after 3/ODR when enabling Self-Test mode due to device filtering 10. ODR is output data rate. Refer to table 3 for specifications |
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