6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

PARAMETER

TEST CONDITIONS

MIN

MAX

UNIT

Supply voltage range 1.8 V, AVDD

–0.3

2.1

V

Supply voltage range 1.8 V to 3.3 V, IOVDD

–0.3

3.6

Supply voltage range, GND, DGND

–0.3

0.3

Voltage applied to input pins

INAP/M, INBP/M, CLK

–0.3

2.1

RESET, PDN, M0 , M1, M2

–0.3

2.1

Junction temperature, TJ

125

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

1000

V

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2)

500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage range

Supply voltage range 1.8v

AVDD(1)

1.7

1.8

1.9

V

Supply voltage range

IOVDD(1)

1.7

1.8

1.9

V

Supply voltage range

Supply voltage range 3.3v

IOVDD(1)

3.2

3.3

3.4

V

TA

Operating free-air temperature

–40

105

°C

TJ

Operating junction temperature

115(2)

°C

(1)

Measured to GND.

(2)

Prolonged use above this junction temperature may increase the device failure-in-time (FIT) rate.

6.4 Thermal Information

THERMAL METRIC(1)

ADC39xx

UNIT

RSM (QFN)

32 Pins

RΘJA

Junction-to-ambient thermal resistance

38.1

°C/W

RΘJC(top)

Junction-to-case (top) thermal resistance

37.2

°C/W

RΘJB

Junction-to-board thermal resistance

17.9

°C/W

ΨJT

Junction-to-top characterization parameter

1

°C/W

ΨJB

Junction-to-board characterization parameter

17.9

°C/W

RΘJC(bot)

Junction-to-case (bottom) thermal resistance

7.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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ADC3908D025, ADC3908D065, ADC3908D125

ADC3908S025, ADC3908S065, ADC3908S125

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