25Q128FVPF datasheet(2/99 Pages) WINBOND

2 / 99 page

W25Q128FV

- 1 -

Table of Contents

1. GENERAL DESCRIPTIONS...................................................................................................................... 5

2. FEATURES................................................................................................................................................ 5

3. PACKAGE TYPES AND PIN CONFIGURATIONS ................................................................................... 6

3.1

Pin Configuration SOIC / VSOP 208-mil........................................................................................... 6

3.2

Pad Configuration WSON 6x5-mm / 8x6-mm .................................................................................. 6

3.3

Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm .................................................. 6

3.4

Pin Configuration SOIC 300-mil........................................................................................................ 7

3.5

Pin Description SOIC 300-mil ........................................................................................................... 7

3.6

Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array).............................................................. 8

3.7

Ball Description TFBGA 8x6-mm ...................................................................................................... 8

3.8

Pin Configuration PDIP 300-mil ........................................................................................................ 9

3.9

Pin Description PDIP 300-mil............................................................................................................ 9

4. PIN DESCRIPTIONS............................................................................................................................... 10

4.1

Chip Select (/CS) ............................................................................................................................ 10

4.2

Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ............................................... 10

4.3

Write Protect (/WP)......................................................................................................................... 10

4.4

HOLD (/HOLD)................................................................................................................................ 10

4.5

Serial Clock (CLK) .......................................................................................................................... 10

4.6

Reset (/RESET) .............................................................................................................................. 10

5. BLOCK DIAGRAM................................................................................................................................... 11

6. FUNCTIONAL DESCRIPTIONS.............................................................................................................. 12

6.1

SPI / QPI Operations ...................................................................................................................... 12

6.1.1

Standard SPI Instructions...............................................................................................................................12

6.1.2

Dual SPI Instructions ......................................................................................................................................12

6.1.3

Quad SPI Instructions.....................................................................................................................................13

6.1.4

QPI Instructions ..............................................................................................................................................13

6.1.5

Hold Function .................................................................................................................................................13

6.1.6

Software Reset & Hardware /RESET pin .......................................................................................................14

6.2

Write Protection .............................................................................................................................. 15

6.2.1

Write Protect Features ...................................................................................................................................15

7. STATUS AND CONFIGURATION REGISTERS..................................................................................... 16

7.1

Status Registers.............................................................................................................................. 16

7.1.1

Erase/Write In Progress (BUSY)

– Status Only..............................................................................................16

7.1.2

Write Enable Latch (WEL)

– Status Only .......................................................................................................16

7.1.3

Block Protect Bits (BP2, BP1, BP0)

– Volatile/Non-Volatile Writable .............................................................16

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