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HD64338024 bảng dữ liệu(PDF) 58 Page - Renesas Technology Corp |
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HD64338024 bảng dữ liệu(HTML) 58 Page - Renesas Technology Corp |
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58 / 697 page  Section 1 Overview Rev. 7.00 Mar 10, 2005 page 16 of 652 REJ09B0042-0700 Table 1.3 Bonding Pad Coordinates of HCD64F38024, HCD64F38024R Coordinates Coordinates Pad No. Pad Name X ( µµµµm) Y ( µµµµm) Pad No. Pad Name X ( µµµµm) Y ( µµµµm) 1 PB7/AN7 –1802 1904 42 P83/SEG28 1802 –1898 2AVCC –1802 1717 43 P84/SEG29 1802 –1750 3 P13/TMIG –1802 1443 44 P85/SEG30 1802 –1594 4 P14/ IRQ4/ADTRG –1802 1292 45 P86/SEG31 1802 –1454 5 P16 –1802 1157 46 P87/SEG32 1802 –1296 6 P17/ IRQ3/TMIF –1802 1022 47 PA3/COM4 1802 –1182 7 X1 –1802 887 48 PA2/COM3 1802 –1068 8 X2 –1802 753 49 PA1/COM2 1802 –954 9AVSS –1802 638 50 PA0/COM1 1802 –840 10 VSS –1802 473 51 V3 1802 –726 11 OSC2 –1802 318 52 V2 1802 –534 12 OSC1 –1802 202 53 V1 1802 –402 13 TEST –1802 69 54 VCC 1802 –267 14 RES –1802 –63 55 VSS 1802 –126 15 P50/ WKP0/SEG1 –1802 –195 56 P90/PWM1 1802 206 16 P51/ WKP1/SEG2 –1802 –355 57 P91/PWM2 1802 457 17 P52/ WKP2/SEG3 –1802 –514 58 P92 1802 707 18 P53/ WKP3/SEG4 –1802 –674 59 P93 1802 958 19 P54/ WKP4/SEG5 –1802 –844 60 P94 1802 1209 20 P55/ WKP5/SEG6 –1802 –1008 61 P95 1802 1460 21 P56/ WKP6/SEG7 –1802 –1348 62 IRQAEC 1802 1710 22 P57/ WKP7/SEG8 –1802 –1709 63 P30/UD 1802 1904 23 P60/SEG9 –1802 –1904 64 P31/TMOFL 1686 1999 24 P61/SEG10 –1686 –1999 65 P32/TMOFH 1222 1999 25 P62/SEG11 –1198 –1999 66 P33 1077 1999 26 P63/SEG12 –1057 –1999 67 P34 932 1999 27 P64/SEG13 –916 –1999 68 P35 788 1999 28 P65/SEG14 –755 –1999 69 P36/AEVH 643 1999 29 P66/SEG15 –625 –1999 70 P37/AEVL 498 1999 30 P67/SEG16 –493 –1999 71 P40/SCK32 353 1999 31 P70/SEG17 –352 –1999 72 P41/RXD32 226 1999 32 P71/SEG18 –202 –1999 73 P42/TXD32 63 1999 33 P72/SEG19 –69 –1999 74 P43/ IRQ0 –82 1999 34 P73/SEG20 72 –1999 75 PB0/AN0 –229 1999 35 P74/SEG21 213 –1999 76 PB1/AN1 –404 1999 36 P75/SEG22 330 –1999 77 PB2/AN2 –577 1999 37 P76/SEG23 459 –1999 78 PB3/AN3/ IRQ1/TMIC –751 1999 38 P77/SEG24 583 –1999 79 PB4/AN4 –925 1999 39 P80/SEG25 730 –1999 80 PB5/AN5 –1099 1999 40 P81/SEG26 937 –1999 81 PB6/AN6 –1686 1999 41 P82/SEG27 1686 –1999 Note: VSS Pads (No. 9 and 10) should be connected to power supply lines. TEST Pad (No. 13) should be connected to VSS. If the pad of these aren’t connected to the power supply line, the LSI will not operate correctly. These values show the coordinates of the centers of pads. The accuracy is ±5 µm. The home-point position is the chip’s center and the center is located at half the distance between the upper and lower pads and left and right pads. |
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