12

Handling, moisture, and reflow precautions

12.1

Shock precaution

Sensor modules house numerous internal components that are susceptible to shock damage. If a unit is subject

to excessive shock, it must be rejected even if no apparent damage is visible. For example, if it is dropped on the

floor, or if a tray/reel of units is dropped on the floor.

12.2

Part handling

Handling must be done with nonmarring, ESD, safe carbon, plastic, or Teflon™ tweezers. Ranging modules are

susceptible to damage or contamination. The customer is advised to use a clean assembly process after

removing the tape from the parts, and until a protective cover glass is mounted.

12.3

Compression force

A maximum compressive load of 25 N should be applied on the module.

12.4

Moisture sensitivity level

Moisture sensitivity is level 3 (MSL) as described in JEDEC JSTD-020-C.

For devices that are classified to the levels defined in JEDEC JSTD-020-C, JEDEC JSTD-033-C provides:

•

Manufacturers and users with standardized methods for handling, packing, and shipping.

•

Standardized methods for using moisture/reflow and process sensitive devices.

12.5

Pb-free solder reflow process

Table 19. Recommended solder profile and Figure 32. Solder profile show the recommended and maximum

values for the solder profile.

Customers have to tune the reflow profile depending on the PCB, solder paste, and material used. We expect

customers to follow the recommended reflow profile, which is specifically tuned for the VL53L4ED package.

If a customer must perform a reflow profile which is different from the recommended one, the new profile must be

qualified by the customer at their own risk. This is especially true for peak >240°C. In any case, the profile must

be within the “maximum” profile limit described in JEDEC JSTD-020-C and in the table below.

Note:

Temperatures mentioned in the following table are measured at the top of the VL53L4ED package.

Table 19. Recommended solder profile

Parameters

Recommended

Maximum

Unit

Minimum temperature (TS min)

130

150

°C

Maximum temperature (TS max)

200

200

Time ts (TS min to TS max)

90-110

60-120

s

Temperature (TL)

217

217

°C

Time (tL)

55-65

55-65

s

Ramp up

2

3

°C/s

Temperature (Tp-10)

—

250

°C

Time (tp-10)

10

s

Ramp up

3

°C/s

Peak temperature (Tp)

240

260 max

°C

Time to peak

30

300

s

Ramp down (peak to Tl)

-4

-6

°C/s

VL53L4ED

Handling, moisture, and reflow precautions

DS14256 - Rev 3

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