10.2

TSSOP8 package information

This TSSOP is an 8-lead, 3 x 6.4 mm, 0.65 mm pitch, thin shrink small outline package.

Figure 22. TSSOP8 – Outline

1

c

L

E

D

k

e

4

L1

E1

A2

A

b

8

5

A1

1.

Drawing is not to scale.

Table 17. TSSOP8 – Mechanical data

Symbol

millimeters

inches (1)

Min.

Typ.

Max.

Min.

Typ.

Max.

A

-

-

1.200

-

-

0.0472

A1

0.050

-

0.150

0.0020

-

0.0059

A2

0.800

1.000

1.050

0.0315

0.0394

0.0413

b

0.190

-

0.300

0.0075

-

0.0118

c

0.090

-

0.200

0.0035

-

0.0079

D(2)

2.900

3.000

3.100

0.1142

0.1181

0.1220

e

-

0.650

-

-

0.0256

-

E

6.200

6.400

6.600

0.2441

0.2520

0.2598

E1(3)

4.300

4.400

4.500

0.1693

0.1732

0.1772

L

0.450

0.600

0.750

0.0177

0.0236

0.0295

L1

-

1.000

-

-

0.0394

-

k

0°

-

8°

0°

-

8°

aaa

-

-

0.100

-

-

0.0039

1. Values in inches are converted from mm and rounded to four decimal digits.

2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed

0.15 mm per side

3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per

side.

M24256E-F

TSSOP8 package information

DS12687 - Rev 3

page 34/46