Analog Integrated Circuit Device Data

Freescale Semiconductor

7

34921

MAXIMUM RATINGS

THERMAL RATINGS

Operating Temperature

Ambient

Junction

0.0 to 70

150

°C

Storage Temperature

-55 to 150

°C

Thermal Resistance

Junction to Ambient(3)

Junction to Board(4)

Junction to Case

40

14

<1.0

Peak Package Reflow Temperature During Solder Mounting (5)

245

°C

THERMAL RESISTANCE AND PACKAGE DISSIPATION RATINGS

(6)

2.0

W

Notes

3.

1s PCB test board JESD51-2 and SEMI G38-87.

4.

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured at the package

center lead foot. 2s2p test board, exposed pad soldered to PCB.

5.

Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits

may cause malfunction or permanent damage to the device.

6.

Maximum power dissipation at indicated ambient temperature in free air with no heatsink used.

Table 2. Maximum Ratings(continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Rating

Symbol

Max

Unit