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PHT2NQ10T bảng dữ liệu(PDF) 2 Page - NXP Semiconductors |
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PHT2NQ10T bảng dữ liệu(HTML) 2 Page - NXP Semiconductors |
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2 / 12 page ![]() Philips Semiconductors PHT2NQ10T N-channel TrenchMOS transistor Product data Rev. 01 — 16 October 2001 2 of 12 9397 750 08918 © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 5. Quick reference data 6. Limiting values Table 2: Quick reference data Symbol Parameter Conditions Typ Max Unit VDS drain-source voltage (DC) 25 °C ≤ to ≤ 150 °C − 100 V ID drain current (DC) Tsp =25 °C; VGS =10V − 2.5 A Ptot total power dissipation Tsp =25 °C − 6.25 W Tj junction temperature − 150 °C RDSon drain-source on-state resistance VGS = 10 V; ID = 1.75 A 315 430 m Ω Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage (DC) 25 °C ≤ to ≤ 150 °C − 100 V VDGR drain-gate voltage (DC) 25 °C ≤ to ≤ 150 °C; RGS =20kΩ− 100 V VGS gate-source voltage (DC) −±20 V ID drain current (DC) Tsp =25 °C; VGS =10V; Figure 2 and 3 − 2.5 A Tsp = 100 °C; VGS =10V; − 1.6 A IDM peak drain current Tsp =25 °C; pulsed; tp ≤ 10 µs; Figure 3 − 10 A Ptot total power dissipation Tsp =25 °C; Figure 1 − 6.25 W Tstg storage temperature −65 +150 °C Tj operating junction temperature −65 +150 °C Source-drain diode IS source (diode forward) current (DC) Tsp =25 °C − 2.5 A ISM peak source (diode forward) current Tsp =25 °C; tp ≤ 10 µs − 10 A Avalanche ruggedness EAS non-repetitive avalanche energy unclamped inductive load; ID =2.5 A; tp = 0.2 ms; VDD ≤ 15 V; RGS =50 Ω; VGS = 10 V; starting Tj =25 °C; Figure 4 − 32 mJ IAS non-repetitive avalanche current unclamped inductive load; VDD ≤ 15 V; RGS =50 Ω; VGS =10V; Figure 4 − 2.5 A |
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