56F8014 datasheet(92/125 Pages) FREESCALE

92 / 125 page

56F8014 Technical Data, Rev. 9

Freescale Semiconductor

Preliminary

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

3. Per JEDEC JESC51-6 with the board horizontal.

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is

measured on the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per

JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

7. See Section 12.1 for more details on thermal design considerations.

Table 10-3 LQFP Package Thermal Characteristics6

Characteristic

Comments

Symbol

Value

(LQFP)

Unit

Notes

Junction to ambient

Natural convection

Single layer board

(1s)

RθJA

°C/W

1,2

Junction to ambient

Natural convection

Four layer board

(2s2p)

RθJMA

°C/W

1,3

Junction to ambient

(@200 ft/min)

Single layer board

(1s)

RθJMA

°C/W

1,3

Junction to ambient

(@200 ft/min)

Four layer board

(2s2p)

RθJMA

°C/W

1,3

Junction to board

RθJB

°C/W

Junction to case

RθJC

°C/W

Junction to package top

Natural Convection

ΨJT

4°C/W

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