TCS34001FN datasheet(28/35 Pages) OSRAM

tên linh kiện	TCS34001FN

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28 / 35 page

Datasheet, Public

Page 27

[v2-00] 2023-Feb-09

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TCS3400 − Soldering & Storage Information

The FN package has been tested and has demonstrated an

ability to be reflow soldered to a PCB substrate.

The solder reflow profile describes the expected maximum heat

exposure of components during the solder reflow process of

product on a PCB. Temperature is measured on top of

component. The components should be limited to a maximum

of three passes through this solder reflow profile.

Figure 38:

Solder Reflow Profile

Figure 39:

Solder Reflow Profile Graph

Parameter

Reference

Device

Average temperature gradient in preheating

2.5°C/s

Soak time

tsoak

2 to 3 minutes

Time above 217°C (T1)t1

Max 60 s

Time above 230°C (T2)t2

Max 50 s

Time above Tpeak - 10°C (T3)t3

Max 10 s

Peak temperature in reflow

Tpeak

260°C

Temperature gradient in cooling

Max -5°C/s

Soldering & Storage

Information

Not to Scale

Tpeak

Time in seconds

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