S32K311NHT0MPAST datasheet(55/143 Pages) NXP

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8. For the maximum allowable RUN current in an application, the junction temperature must be kept below the maximum

specification, TJ < 150°C, to avoid self-heating.

9. If the total power dissipation would cause the junction temperature to be exceeded when VDD_HV_A is at 5V, then

VDD_HV_A should be limited to operate at 3.3V.

The data in this table is preliminary and based on first samples.

NOTE

Typical current numbers are indicative for typical silicon process and may vary based on the silicon distribution and user

configuration. Typical conditions assumes VDD_HV_A = VREFH = 5 V, VDD_HV_B = 5V (if the VDD_HV_B domain present in the

device), temperature = 25 °C and typical silicon process unless otherwise stated.

Table 19. Example RUN mode configuration supply currents for S32K3x8, S32K34x, S32K32x and S32K314

Chip

Ambient

Temperature

(°C)

RUN Mode (mA) 1

S32K388

25, typ 7

TBD

25, max 8

TBD

85, typ 7

TBD

85, max 8

TBD

105, typ 7

TBD

105, max 8

TBD

125, typ 7

TBD

125, max 8, 9

TBD

S32K358,

S32K348,

S32K338,

S32K328

25, typ 7

207.6

168.6

177.5

146.8

114.9 313

380.2

2.1

5.3

25, max 8

229.4

188.3

197.4

167.9

135.3 340

395.9

3.2

6.0

85, typ 7

235.5

195.9

205.1

174.0

141.6 333.4

413.6

2.1

6.3

Table continues on the next page...

NXP Semiconductors

Power management

S32K3xx Data Sheet, Rev. 9.1, 03/2024

Data Sheet: Technical Data

Preliminary Information for S32K388

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