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TPSM861253 bảng dữ liệu(PDF) 16 Page - Texas Instruments |
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TPSM861253 bảng dữ liệu(HTML) 16 Page - Texas Instruments |
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16 / 24 page ![]() 8.4 Layout 8.4.1 Layout Guidelines • Make sure the VIN and GND traces are as wide as possible to reduce trace impedance. The wide areas are also an advantage from the view point of heat dissipation. • Place the input capacitor and output capacitor as close to the device as possible to minimize trace impedance. • Provide sufficient vias for the input capacitor and output capacitor. • Connect a separate VOUT path to VOS pin. • Place a voltage feedback loop away from the high-voltage switching trace, and preferably has ground shield. • Make sure the GND trace between the output capacitor and the GND pin are as wide as possible to minimize the trace impedance. 8.4.2 Layout Example EN VIN VOUT GND COUT CIN VIA (connect to another layer) VIN EN VOS PG PGND VOUT SW GND The line in another layer Figure 8-12. Layout Guide TPSM861253 SLUSFD2A – SEPTEMBER 2023 – REVISED JANUARY 2024 www.ti.com 16 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: TPSM861253 |
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