6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

range

VDD3V3

–0.3

4.32

V

Analog Supply

voltage range

VDD1V8

–0.3

2.1

V

Voltage range

DPA, DNA, DPB, DNB , 1000 total number of short events and

cumulative duration of 1000 hrs.

–0.3

6

V

Voltage range

eDP0, eDN0, eDP1, eDN1

–0.3

1.6

V

Voltage range

CROSS, RESETB, RSVD1, RSVD2, RSVD3, EQ1, EQ0

–0.3

2.1

V

Junction

temperature

TJ(max)

125

°C

Storage

temperature

Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated

under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±1500

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD3V3

Supply voltage (VDD3V3)

3.0

3.3

3.6

V

VDD1V8

Analog Supply voltage (VDD1V8)

1.62

1.8

1.98

V

TA

Operating free-air temperature

-20

85

°C

TJ

Junction temperature

-20

105

°C

TCASE

Case temperature

-20

105

°C

TPCB

PCB temperature (1mm away from the device)

-20

92

°C

TUSB2E22

SNLS648B – FEBRUARY 2019 – REVISED OCTOBER 2023

www.ti.com

6

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