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7.1.1 Thermal Data for ZDU

7.1.2 Packaging Information

TMS320C6421

Fixed-Point Digital Signal Processor

SPRS346A – JANUARY 2007 – REVISED MARCH 2007

Table 7-2. Thermal Resistance Characteristics (PBGA Package) [ZDU]

NO.

°C/W(1)

AIR FLOW (m/s)(2)

Junction-to-case

7.7

N/A

Junction-to-board

10.5

N/A

19.7

0.00

Junction-to-free air

15.5

1.0

14.3

2.00

4.9

0.00

PsiJT

Junction-to-package top

5.1

1.0

5.2

2.00

10.4

0.00

PsiJB

Junction-to-board

9.8

1.0

9.6

2.00

(1)

The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC

defined 1S2P system and will change based on environment as well as application.

For more information, see these three EIA/JEDEC standards:

•

EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

•

EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

(2)

m/s = meters per second

The following packaging information and addendum reflect the most current data available for the

designated device(s). This data is subject to change without notice and without revision of this document.

Mechanical Data

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