MSPM0C1104SDYYR datasheet(13/77 Pages) TI

13 / 77 page

7.4 Thermal Information

THERMAL METRIC(1)

PACKAGE

VALUE

UNIT

RθJA

Junction-to-ambient thermal resistance

VSSOP-20 (DGS20)

91.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

29.3

°C/W

RθJB

Junction-to-board thermal resistance

48.3

°C/W

ΨJT

Junction-to-top characterization parameter

0.7

°C/W

ΨJB

Junction-to-board characterization parameter

47.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

RθJA

Junction-to-ambient thermal resistance

TSSOP-20 (PW20)

98.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

39.3

°C/W

RθJB

Junction-to-board thermal resistance

50.0

°C/W

ΨJT

Junction-to-top characterization parameter

5.6

°C/W

ΨJB

Junction-to-board characterization parameter

49.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

RθJA

Junction-to-ambient thermal resistance

WQFN-20 (RUK)

52.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

55.5

°C/W

RθJB

Junction-to-board thermal resistance

26.4

°C/W

ΨJT

Junction-to-top characterization parameter

2.1

°C/W

ΨJB

Junction-to-board characterization parameter

26.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

12.0

°C/W

RθJA

Junction-to-ambient thermal resistance

SOT-16 (DYY)

117.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

54.5

°C/W

RθJB

Junction-to-board thermal resistance

54.6

°C/W

ΨJT

Junction-to-top characterization parameter

3.0

°C/W

ΨJB

Junction-to-board characterization parameter

54.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

RθJA

Junction-to-ambient thermal resistance

SOT-8 (DDF)

142.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

65.7

°C/W

RθJB

Junction-to-board thermal resistance

62.7

°C/W

ΨJT

Junction-to-top characterization parameter

3.2

°C/W

ΨJB

Junction-to-board characterization parameter

62.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

RθJA

Junction-to-ambient thermal resistance

WSON-8 (DSG)

70.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

85.6

°C/W

RθJB

Junction-to-board thermal resistance

37.5

°C/W

ΨJT

Junction-to-top characterization parameter

2.7

°C/W

ΨJB

Junction-to-board characterization parameter

37.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

12.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Supply Current Characteristics

www.ti.com

MSPM0C1104, MSPM0C1103

SLASF90 – OCTOBER 2023

Submit Document Feedback

Product Folder Links: MSPM0C1104 MSPM0C1103

MSPM0C1104SDYYR bảng dữ liệu(PDF) 13 Page - Texas Instruments

MSPM0C1104SDYYR bảng dữ liệu(HTML) 13 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77

bảng dữ liệu tải về

Link URL