MSPM0C1104SDYYR datasheet(39/77 Pages) TI

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10 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions are listed below.

10.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP

MCU devices and support tools. . Each MSP MCU commercial family member has one of two prefixes: MSP

or X. These prefixes represent evolutionary stages of product development from engineering prototypes (X)

through fully qualified production devices (MSP).

X – Experimental device that is not necessarily representative of the final device's electrical specifications

MSP – Fully qualified production device

X devices are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes." MSP devices have been characterized

fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X) have a greater failure rate than the standard production devices. TI

recommends that these devices not be used in any production system because their expected end-use failure

rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature

range, package type, and distribution format. Figure 10-1 provides a legend for reading the complete device

name.

Processor Family

MCU Platform

Product Family

Device Subfamily

Flash Memory

Temperature range

Package Type

Distribution Format

MSP M0 C 110 4 S RUK R

Figure 10-1. Device Nomenclature

Table 10-1. Device Nomenclature

Processor Family

MSP = Mixed-signal processor

X= Experimental silicon

MCU Platform

M0 = Arm-based 32-bit M0+

Product Family

C = 24-MHz frequency

Device Subfamily

110 = ADC

Flash Memory

3 = 8KB

4 = 16KB

Temperature Range

S = –40°C to 125°C

Package Type

See Table 5-1 and www.ti.com/packaging

Distribution Format

T = Small reel

R = Large reel

No marking = Tube or tray

For orderable part numbers of MSP devices in different package types, see the Package Option Addendum of

this document, ti.com, or contact your TI sales representative.

www.ti.com

MSPM0C1104, MSPM0C1103

SLASF90 – OCTOBER 2023

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