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UPD750004 bảng dữ liệu(PDF) 75 Page - Renesas Technology Corp |
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UPD750004 bảng dữ liệu(HTML) 75 Page - Renesas Technology Corp |
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75 / 86 page ![]() µPD750004, 750006, 750008, 750004(A), 750006(A), 750008(A) 73 Data Sheet U10738EJ3V2DS 15. RECOMMENDED SOLDERING CONDITIONS The µPD750004, µPD750006, and µPD750008 should be soldered and mounted under the following recommended conditions. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Table 15-1. Surface Mounting Type Soldering Conditions (1/2) (1) µPD750004GB-×××-3BS-MTX: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch) µPD750006GB-×××-3BS-MTX: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch) µPD750008GB-×××-3BS-MTX: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch) µPD750004GB(A)-×××-3BS-MTX: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch) µPD750006GB(A)-×××-3BS-MTX: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch) µPD750008GB(A)-×××-3BS-MTX: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch) Soldering Soldering Conditions Recommended Method Condition Symbol Infrared reflow Package peak temperature: 235˚C, Time: 30 seconds max. (at 210˚C or higher), IR35-00-3 Count: Three times or less VPS Package peak temperature: 215˚C, Time: 40 seconds max. (at 200˚C or higher), VP15-00-3 Count: Twice or less Wave soldering Solder bath temperature: 260˚C max., Time: 10 seconds max., Count: Once WS60-00-1 Preheating temperature: 120˚C max. (package surface temperature) Partial heating Pin temperature: 350˚C max., Time: 3 seconds max. (per pin row) — Caution Do not use different soldering methods together (except for partial heating). Remark For soldering methods and conditions other than those recommended above, contact an NEC Electronics sales representative. |
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