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UPD750004 bảng dữ liệu(PDF) 75 Page - Renesas Technology Corp

tên linh kiện UPD750004
Giải thích chi tiết về linh kiện  MOS INTEGRATED CIRCUIT
PDF  86 Pages
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nhà sản xuất  RENESAS [Renesas Technology Corp]
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UPD750004 bảng dữ liệu(HTML) 75 Page - Renesas Technology Corp

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µPD750004, 750006, 750008, 750004(A), 750006(A), 750008(A)
73
Data Sheet U10738EJ3V2DS
15. RECOMMENDED SOLDERING CONDITIONS
The
µPD750004, µPD750006, and µPD750008 should be soldered and mounted under the following recommended
conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 15-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
µPD750004GB-×××-3BS-MTX:
44-pin plastic QFP (10
× 10 mm, 0.8 mm pitch)
µPD750006GB-×××-3BS-MTX:
44-pin plastic QFP (10
× 10 mm, 0.8 mm pitch)
µPD750008GB-×××-3BS-MTX:
44-pin plastic QFP (10
× 10 mm, 0.8 mm pitch)
µPD750004GB(A)-×××-3BS-MTX: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch)
µPD750006GB(A)-×××-3BS-MTX: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch)
µPD750008GB(A)-×××-3BS-MTX: 44-pin plastic QFP (10 × 10 mm, 0.8 mm pitch)
Soldering
Soldering Conditions
Recommended
Method
Condition Symbol
Infrared reflow
Package peak temperature: 235˚C, Time: 30 seconds max. (at 210˚C or higher),
IR35-00-3
Count: Three times or less
VPS
Package peak temperature: 215˚C, Time: 40 seconds max. (at 200˚C or higher),
VP15-00-3
Count: Twice or less
Wave soldering
Solder bath temperature: 260˚C max., Time: 10 seconds max., Count: Once
WS60-00-1
Preheating temperature: 120˚C max. (package surface temperature)
Partial heating
Pin temperature: 350˚C max., Time: 3 seconds max. (per pin row)
—
Caution Do not use different soldering methods together (except for partial heating).
Remark
For soldering methods and conditions other than those recommended above, contact an NEC Electronics
sales representative.



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