UPD17062 datasheet(293/298 Pages) RENESAS

293 / 298 page

291

µPD17062

26. RECOMMENDED SOLDERING CONDITIONS

The conditions listed below shall be met when soldering the

µPD17062.

For details of the recommended soldering conditions, refer to our document

SMD Surface Mount

Technology Manual (IEI-1207).

Please consult with our sales offices in case any other soldering process is used, or in case soldering is

done under different conditions.

Table 26-1

Soldering Conditions for Surface-Mount Devices

µPD17062GC-×××-3BE:

64-pin plastic QFP (14

× 14 mm)

Symbol

IR35-207-1

VP15-207-2

–

Soldering process

Infrared ray reflow

VPS

Partial heating method

Soldering conditions

Peak package’s surface temperature: 235 ˚C

Reflow time: 30 seconds or less (at 210 ˚C or more)

Maximum allowable number of reflow processes: 1

Exposure limit Note: 7 days (20 hours of pre-baking is required at

125 ˚C afterward.)

Peak package’s surface temperature: 215 ˚C

Reflow time: 40 seconds or less (at 200 ˚C or more)

Maximum allowable number of reflow processes: 2

Exposure limit Note: 7 days (20 hours of pre-baking is required at

125 ˚C afterward.)

(1) Do not start reflow-soldering the device if its temperature is

higher than the room temperature because of a previous

reflow soldering.

(2) Do not use water for flux cleaning before a second reflow

soldering.

Terminal temperature: 300 ˚C or less

Heat time: 3 seconds or less (for each side of device)

Note Exposure limit before soldering after dry-pack package is opened.

Storage conditions: Temperature of 25 ˚C and maximum relative humidity at 65% or less

Caution Do not apply more than a single process at once, except for “Partial heating method.”

Table 26-2

Soldering Conditions for Through Hole Mount Devices

µPD17062CU-×××: 48-pin plastic shrink DIP (600 mil)

Caution In wave soldering, apply solder only to the lead section. Care must be taken that jet solder does

not come in contact with the main body of the package.

Wave soldering

(only for leads)

Partial heating method

Soldering process

Soldering conditions

Solder temperature: 260

°C or less

Flow time: 10 seconds or less

Terminal temperature: 260

°C or less

Heat time: 10 seconds or less

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