MCP98244 datasheet(46/52 Pages) MICROCHIP

tên linh kiện	MCP98244

Giải thích chi tiết về linh kiện	DDR4 DIMM Temperature Sensor with EEPROM for SPD

PDF	52 Pages

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46 / 52 page

MCP98244

DS20002327D-page 46

 2012-2022 Microchip Technology Inc. and its subsidiaries

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

1.50

1.60

MILLIMETERS

0.50 BSC

MIN

MAX

Contact Pad Length (X8)

Contact Pad Width (X8)

0.85

0.25

Microchip Technology Drawing No. C04-129-MN Rev. B

NOM

8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]

Contact Pad Spacing

2.90

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

ØV

SILK SCREEN

With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)

MCP98244 bảng dữ liệu(PDF) 46 Page - Microchip Technology