| công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
|
MPM54504 bảng dữ liệu(PDF) 16 Page - Monolithic Power Systems |
|
|
|||||||||||||||||||||||||||||
MPM54504 bảng dữ liệu(HTML) 16 Page - Monolithic Power Systems |
|
16 / 20 page ![]() MPM54504 – 16V, QUAD 5A, POWER MODULE MPM54504 Rev. 1.0 MonolithicPower.com 16 3/19/2021 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2021 MPS. All Rights Reserved. OUT OUT OUT 2 SW OUT IN VV V (1 ) 8 f L C V (8)If using POSCAP capacitors, the ESR dominates the impedance at the switching frequency. For simplification, the output ripple can be estimated with Equation (9): OUT OUT OUT ESR SW IN VV V (1 ) R f L V (9) In addition to considering the output ripple, a larger-value output capacitor improves the load transient response. However, the maximum output capacitor limit should be also considered in design applications. If the output capacitor value is too high, the output voltage cannot reach the design value during the soft-start time, and the device fails to regulate. The maximum output capacitor value (CO_MAX) can be calculated using Equation (10): O _MAX LIM_ AVG OUT ss OUT C (I I ) t / V (10) Where ILIM_AVG is the average start-up current during soft start, and tSS is the soft-start time. PCB Layout Guidelines The PCB layout is critical for stable operation. A 6-layer layout is recommended to improve thermal performance. For the best results, refer to Figure 7 and follow the guidelines below: 1. Keep the power loop as small as possible. 2. Use a large ground plane to connect directly to PGND. Add as many vias as possible on the PGND plane, and near the device to improve thermal performance. 3. Ensure that the high-current paths at GND and VIN have short, direct, and wide traces. 4. Place the ceramic input capacitor, especially capacitors with a small package size (0402), as close to the VIN and PGND pins as possible to minimize high-frequency noise. Keep the input capacitor and VIN pin traces as short and wide as possible. 5. Place the VCC capacitor as close to the VCC pin and GND as possible. 6. Do not place the GND plane under the device. 2 1 A3 B3 C3 D3 E3 2 1 2 1 2 1 2 1 VOUT4 VOUT2 VOUT1 GND VIN 2 1 2 1 2 1 2 1 VOUT3 VIN VOUT1 VOUT2 VOUT3 VOUT4 GND Vias GND GND Figure 7: Recommended PCB Layout |
|
|
Link URL |
| Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không? [ DONATE ] |
Alldatasheet là | Quảng cáo | Liên lạc với chúng tôi | Chính sách bảo mật | Liên kết đến bảng dữ liệu | Trao đổi link | Tìm kiếm theo nhà sản xuất All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |