6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)

MIN

MAX

UNIT

Supply Voltage

V+ to V-, Voltages Referenced to

VSS Terminal

–0.5

20

V

DC Input Voltage

–0.5

VDD+0.5

V

DC Input Current

Any One Input

–10

10

mA

TJMAX1

Maximum junction temperature, ceramic package

175

°C

TJMAX2

Maximum junction temperature, plastic package

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated

under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

All voltages are with respect to ground, unless otherwise specified.

6.2 ESD Ratings

VALUE

UNIT

CD4051B in PDIP, CDIP, SOIC, and SOP Packages

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±3000

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±2000

CD4053B in PDIP, CDIP and SOP Packages

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±2500

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±1500

CD4051B and CD4053B in TSSOP Package

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins((1))

±2000

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins((2))

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Temperature Range

–55

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

CD405x

UNIT

E (PDIP)

M (SOIC)

NS (SOP)

PW (TSSOP)

16 PINS

16 PINS

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

67

73

64

116.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

CD4051B, CD4052B, CD4053B

SCHS047K – AUGUST 1998 – REVISED MARCH 2023

Copyright © 2023 Texas Instruments Incorporated

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