MPC8347E datasheet(98/108 Pages) FREESCALE

tên linh kiện	MPC8347E

Giải thích chi tiết về linh kiện	Integrated Host Processor Hardware Specifications

PDF	108 Pages

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MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 3

Freescale Semiconductor

Thermal

20.3.1

Experimental Determination of the Junction Temperature with a

Heat Sink

When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the

interface between the case of the package and the interface material. A clearance slot or hole is normally

required in the heat sink. Minimize the size of the clearance to minimize the change in thermal

performance caused by removing part of the thermal interface to the heat sink. Because of the experimental

difficulties with this technique, many engineers measure the heat sink temperature and then back calculate

the case temperature using a separate measurement of the thermal resistance of the interface. From this

case temperature, the junction temperature is determined from the junction to case thermal resistance.

TJ = TC + (RθJC × PD)

where:

TJ = junction temperature (°C)

TC = case temperature of the package (°C)

RθJC = junction to case thermal resistance (°C/W)

PD = power dissipation (W)

MPC8347E bảng dữ liệu(PDF) 98 Page - Freescale Semiconductor, Inc