MPC8347E datasheet(59/108 Pages) FREESCALE

tên linh kiện	MPC8347E

Giải thích chi tiết về linh kiện	Integrated Host Processor Hardware Specifications

PDF	108 Pages

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nhà sản xuất	FREESCALE [Freescale Semiconductor, Inc]

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MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 3

Freescale Semiconductor

Package and Pin Listings

18 Package and Pin Listings

This section details package parameters, pin assignments, and dimensions. The MPC8347EA is available

in two packages a tape ball grid array (TBGA) and a plastic ball grid array (PBGA). See Section 18.1,

“Package Parameters for the MPC8347EA TBGA,” and Section 18.2, “Mechanical Dimensions of the

MPC8347EA TBGA,” and Section 18.3, “Package Parameters for the MPC8347EA PBGA” and

Section 18.4, “Mechanical Dimensions of the MPC8347EA PBGA.”

18.1

Package Parameters for the MPC8347EA TBGA

The package parameters are provided in the following list. The package type is 35 mm

× 35 mm, 672 tape

ball grid array (TBGA).

Package outline

35 mm

× 35 mm

Interconnects

672

Pitch

1.00 mm

Module height (typical)

1.46 mm

Solder Balls

62 Sn/36 Pb/2 Ag (ZU package)

95.5 Sn/0.5 Cu/4Ag (VV package)

Ball diameter (typical)

0.64 mm

MPC8347E bảng dữ liệu(PDF) 59 Page - Freescale Semiconductor, Inc