ZSSC4151C Datasheet

© 2022 Renesas Electronics Corporation

2

March 25, 2020

Contents

1.

Pin Assignments...........................................................................................................................................................................................4

1.1 Pin Layout for 24-QFN Package..........................................................................................................................................................4

1.2 Pin Layout for 16-TSSOP Package .....................................................................................................................................................4

2.

Pin Descriptions............................................................................................................................................................................................5

3.

Absolute Maximum Ratings..........................................................................................................................................................................6

4.

Operating Conditions....................................................................................................................................................................................7

5.

Electrical Characteristics ..............................................................................................................................................................................8

5.1 Supply Current and System Operation Conditions..............................................................................................................................8

5.2 Analog Front-End Characteristics........................................................................................................................................................8

5.3 A2D Conversion ..................................................................................................................................................................................9

5.4 Temperature Measurement.................................................................................................................................................................9

5.5 Sensor Diagnostic Tasks.....................................................................................................................................................................9

5.6 DAC and Analog Output (AOUT Pin)...................................................................................................................................................9

5.7 System Response .............................................................................................................................................................................10

5.8 Power Management ..........................................................................................................................................................................11

6.

Interface Characteristics and Nonvolatile Memory .....................................................................................................................................12

6.1 I2C Interface – only for production purposes.....................................................................................................................................12

6.2 ZACwire™ One-Wire Interface (OWI at the AOUT pin) – only for production purposes ...................................................................13

6.3 Nonvolatile Memory (NVM) ...............................................................................................................................................................13

7.

Circuit Description ......................................................................................................................................................................................14

7.1 Signal Path ........................................................................................................................................................................................15

7.2 Signal Measurement..........................................................................................................................................................................16

7.2.1

Full Bridge Sensor Measurement .......................................................................................................................................16

7.2.2

Temperature Measurements ..............................................................................................................................................16

7.2.3

Measurement Cycle............................................................................................................................................................16

7.3 Analog Front-End ..............................................................................................................................................................................17

7.3.1

Overview.............................................................................................................................................................................17

7.3.2

SCCM.................................................................................................................................................................................17

7.3.3

Input Multiplexer .................................................................................................................................................................17

7.3.4

Programmable Gain Amplifier.............................................................................................................................................17

7.3.5

Analog-to-Digital Converter ................................................................................................................................................18

7.4 Signal Conditioning............................................................................................................................................................................18

7.4.1

Full Bridge Sensor Signal Conditioning ..............................................................................................................................18

7.4.2

Conditioning Cycle..............................................................................................................................................................18

7.5 Output Stage .....................................................................................................................................................................................18

8.

Fault-Safe Operation ..................................................................................................................................................................................19

8.1 Fault-Safe Operation Modes .............................................................................................................................................................19

8.1.1

Timing Definitions...............................................................................................................................................................20