P9415-R Datasheet

© 2021 Renesas Electronics Corporation

10

May 4, 2021

3. Absolute Maximum Ratings

The absolute maximum ratings are stress ratings only. Stresses greater than those listed below can cause permanent damage to the device.

Functional operation of the P9415-R at absolute maximum ratings is not implied. Exposure to absolute maximum rating conditions may affect

device reliability.

Table 2.

Absolute Maximum Ratings

Symbol/Pins

Parameter

Minimum

Maximum

Units

TJ

Junction temperature

-

150

°C

TS

Storage temperature

-55

150

°C

HBM

ESD – Human Body Model

-

2000

V

CDM

ESD – Charged Device Model

-

500

V

CMA, CMB, COM1, COM2, PCLAMP, VRECT, AC1, AC2

Maximum voltage

-0.3

26.5

V

BST1, BST2

Maximum voltage

-0.3

AC1+5, AC2+5

V

LDO1P8, GP0-GP6

Maximum voltage

-0.3

2

V

LDO5P0, DEMOD, nEN, ECLAMP_DRV, OD0-OD4

Maximum voltage

-0.3

6

V

PGND

Maximum voltage

-0.3

0.3

V

VOUT

Maximum voltage

-0.3

21

V

CMA, CMB, COM1, COM2

Maximum RMS current

500

mA

AC1, AC2

Maximum RMS current

2

A

VOUT Output Current

Maximum RMS current

1.9

A

4. Thermal Characteristics

Table 3.

Thermal Characteristics[a][b][c][d]

Symbol

Parameter

Value

Units

θJA

Theta JA. Junction to ambient.

45

°C/W

θJB

Theta JB. Junction to board.

4.36

°C/W

θJC

Theta JC. Junction to case.

0.2

°C/W

-

Moisture Sensitivity Rating (Per J-STD-020)

MSL 1

-

[a] The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / θJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will

result in excessive die temperature, and the device will enter thermal shutdown.

[b] This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3” x 4.5” in still air conditions.

[c] Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables.

[d] For the WLCSP (AWQ53) package, connecting 8 PGND balls and at least two other CSP balls (10 thermal balls total) to internal/external ground

planes from top to bottom sides of the PCB is recommended for improving the overall thermal performance.