10

Integrated

Circuit

Systems, Inc.

ICS9214

0809D—04/07/06

Thermal Characteristics

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

θ

JA

Still air

120

°C/W

θ

JA

1 m/s air flow

95

°C/W

θ

JA

3 m/s air flow

80

°C/W

Thermal Resistance Junction to Case

θ

JC

20

°C/W

Thermal Resistance Junction to Top of

Case

Ψ

JT

Still Air

4.5

°C/W

Maximum Case Temp

120

°C

Thermal Resistance Junction to

Ambient

AC Characteristics-Outputs

PARAMETER

1

SYMBOL

CONDITION

MIN

TYP

MAX

UNITS

Output clock cycle time

1.5

2.5

ns

f = 400 to 635 MHz

-

40

ps

f = 635 to 800 MHz

-

30

ps

Output Phase error when

tracking SSC

-100

100

ps

Change in skew

3

AVDD2.5, VDD2.5 =

2.5 V +/- 0.125V

-15

ps

Long term average output

duty cycle

DC

45

55

%

f = 400 to 635 MHz

-

40

ps

f = 635 to 800 MHz

-

30

ps

Output rise and fall times

20% to 80% of output

voltage

100

300

ps

Difference between

output rise and fall time

on same pin of a single

device

20% to 80% of output

voltage, f = 400 to 800 MHz

-

100

ps

Dynamic output

impedance

4

1000

-

Ω

Notes:

5. Guaranteed by design and characterization, not 100% tested in production

is measured at common mode voltage.

2. Output short-term jitter is the absolute value fo the worst case deviation and is

defined in the Jitter section.

3. tSKEW is the timing difference between any two of the four differential clocks and

4. Zout is defined at the output pins.

1. Max and min output clock cycle times are based on nominal output frequencies

of 400 and 667 MHz respectively. For spread spectrum modulated input clocks,

the output clocks track the input modulation.

Short term jitter (over 1 to

6 clock cycles)

2

Cycle-to-cycle duty cycle

error