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IN100-Q1-R-RC1F bảng dữ liệu(PDF) 42 Page - List of Unclassifed Manufacturers |
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IN100-Q1-R-RC1F bảng dữ liệu(HTML) 42 Page - List of Unclassifed Manufacturers |
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42 / 49 page ![]() 41 / 47 www.inplay-tech.com N1EDOC-DS-IN100-EN-V1.3 wettability of solder joints and reduce the temperature gradient across the board. It can also enhance the appearance of the solder joints by reducing the effects of oxidation. The following items should also be observed in the reflow process: • Some recommended pastes include NC-SMQ® 230 flux and Indalloy® 241 solder paste made up of 95.5 Sn/3.8 Ag/0.7 Cu or SENJU N705-GRN3360-K2-V Type 3, no clean paste. • Allowable reflow soldering times: Three times based on the reflow soldering profile as shown in Figure 21. • Temperature profile: Reflow soldering shall be done according to the temperature profile as shown in Figure 21. • Peak temperature: 250°C. Figure 21 : Solder reflow profile |
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