IN100-Q1-R-RC1F datasheet(41/49 Pages) ETC

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N1EDOC-DS-IN100-EN-V1.3

plane to ensure the lowest possible resistive loss. For a PCB with a topside RF ground plane, the

GND (exposed paddle) pins should be connected directly to the ground plane.

8. Reflow Profile Information

This section provides guidelines for reflow processes for soldering the device to the user’s design.

8.1. Storage condition

8.1.1. Moisture barrier bag storage condition (sealed)

A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85%

RH. The calculated shelf life for the dry-packed product shall be 12 months from the date the bag

is sealed.

8.1.2. Moisture barrier bag when opened

Humidity indicator cards must be blue, < 30%.

8.2. Stencil design

The recommended stencil is laser-cut, stainless-steel type with a thickness of 100μm to 130μm

and approximately a 1:1 ratio of stencil opening to pad dimension. To improve paste release, a

positive taper with bottom opening 25μm larger than the top can be utilized. Local manufacturing

experience may find other combinations of stencil thickness and aperture size to get good results.

8.3. Baking conditions

This chip is rated at MSL level 3. After the sealed bag is opened, no baking is required within 168

hours so long as the devices are held at <= 30°C /60% RH or stored at <10% RH.

The chip will require baking before mounting if:

•

The sealed bag has been open for > 168 hours OR.

•

The Humidity Indicator Card reads >10%.

Chips need to be baked for 8 hours at 125 °C.

8.4. Soldering and reflow condition

8.4.1. Reflow oven

It is strongly recommended that a reflow oven equipped with multiple heating zones and Nitrogen

atmosphere be used for lead-free assembly. A nitrogen atmosphere has shown to improve the

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