AP63300/AP63301

Document number: DS42002 Rev. 3 - 2

19 of 22

www.diodes.com

August 2019

© Diodes Incorporated

AP63300/AP63301

Layout

PCB Layout

1.

The AP63300/AP63301 works at 3A load current so heat dissipation is a major concern in the layout of the PCB. 2oz copper for both the top

and bottom layers is recommended.

2.

Place the input capacitors as closely across VIN and GND as possible.

3.

Place the inductor as close to SW as possible.

4.

Place the output capacitors as close to GND as possible.

5.

Place the feedback components as close to FB as possible.

6.

If using four or more layers, use at least the 2

nd and 3rd layers as GND to maximize thermal performance.

7.

Add as many vias as possible around both the GND pin and under the GND plane for heat dissipation to all the GND layers.

8.

Add as many vias as possible around both the VIN pin and under the VIN plane for heat dissipation to all the VIN layers.

9.

See Figure 39 for more details.

FB

EN

VIN

GND

SW

BST

C1

C2

R2

L

C3

GND

SW

VOUT

VIN

FB

Figure 39. Recommended PCB Layout