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AP63301 bảng dữ liệu(PDF) 16 Page - Diodes Incorporated

tên linh kiện AP63301
Giải thích chi tiết về linh kiện  3.8V TO 32V INPUT, 3A LOW IQ SYNCHRONOUS BUCK WITH ENHANCED EMI REDUCTION
PDF  22 Pages
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nhà sản xuất  DIODES [Diodes Incorporated]
Trang chủ  http://www.diodes.com
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AP63301 bảng dữ liệu(HTML) 16 Page - Diodes Incorporated

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AP63300/AP63301
Document number: DS42002 Rev. 3 - 2
16 of 22
www.diodes.com
August 2019
© Diodes Incorporated
AP63300/AP63301
Application Information (cont.)
7
Overcurrent Protection (OCP)
The AP63300/AP63301 has cycle-by-cycle peak current limit protection by sensing the current through the internal high-side power MOSFET, Q1.
While Q1 is on, the internal sensing circuitry monitors its conduction current. Once the current through Q1 exceeds the peak current limit, Q1
immediately turns off. If Q1 consistently hits the peak current limit for 512 cycles, the buck converter enters hiccup mode and shuts down. After
8192 cycles of down time, the buck converter restarts powering up. Hiccup mode reduces the power dissipation in the overcurrent condition.
8
Thermal Shutdown (TSD)
If the junction temperature of the device reaches the thermal shutdown limit of 160°C, the AP63300/AP63301 shuts down both its high-side and
low-side power MOSFETs. When the junction temperature reduces to the required level (135°C typical), the device initiates a normal power-up
cycle with soft-start.
9
Power Derating Characteristics
To prevent the regulator from exceeding the maximum recommended operating junction temperature, some thermal analysis is required. The
regulator’s temperature rise is given by:
Eq. 4
Where:
PD is the power dissipated by the regulator
θJA is the thermal resistance from the junction of the die to the ambient temperature
The junction temperature, TJ, is given by:
Eq. 5
Where:
TA is the ambient temperature of the environment
For the TSOT26 package, the
θJA is 89°C/W. The actual junction temperature should not exceed the maximum recommended operating junction
temperature of 125°C when considering the thermal design. Figure 38 shows a typical derating curve versus ambient temperature.
Figure 38. Output Current Derating Curve vs. Ambient Temperature, VIN = 12V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
20
40
60
80
100
120
140
160
Ambient Temperature (
°C)
VOUT = 1.2V
VOUT = 1.5V
VOUT = 1.8V
VOUT = 2.5V
VOUT = 3.3V
VOUT = 5V



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