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LEOLVDSRD bảng dữ liệu(PDF) 8 Page - STMicroelectronics |
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LEOLVDSRD bảng dữ liệu(HTML) 8 Page - STMicroelectronics |
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8 / 23 page ![]() Symbol Parameters Test conditions Min. Typ. Max. Unit TPZH Load: refer to Figure 7. Enable and disable waveforms for the receiver ns Propagation delay time, high impedance to high level output 3.8 TPZL Propagation delay time, high impedance to low level output 3.8 TD1 Fail-safe to active time 1 µs TD2 Active to fail-safe time 1 µs 1. TSK is the maximum delay time difference between outputs of all devices when they operate with the same supply voltage, at the same temperature. 2. Guaranteed by design and characterization 3. TSKD is the maximum delay time difference between TPHLD and TPLHD. Cold sparing: The LEOLVDSRD features a cold spare input and output buffer. In high reliability applications, cold sparing enables a redundant device to be tied to the data bus with its power supply at 0 V (VCC = GND) without affecting the bus signals or injecting current from the I/Os to the power supplies. Cold sparing also allows redundant devices to be kept powered off so that they can be switched on only when required. This has no impact on the application. Cold sparing is achieved by implementing a high impedance between the I/Os and VCC. ESD protection is ensured through a non-conventional dedicated structure. Fail-safe: In many applications, inputs need a fail-safe function to avoid an uncertain output state when the inputs are not connected properly. In case of an LVDS input short-circuit or floating input, the LVCMOS output remains in stable logic-high state. LEOLVDSRD Electrical characteristics DS13673 - Rev 4 page 8/23 |
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